With its unique high density extreme filling of micronized silver and enhanced thermally conductive ceramic particles, XSPC new extreme thermal paste is the reference premium thermal compound optimised for a wide range of bond lines between modern high power CPUs and performance heatsinks or watercooling solutions.
|Learn More About||XSPC K3 Extreme Tube 1.5g Thermal Paste
Product Type Liquid Cooling Thermal paste
|Hardware Specifications||Quanity 1.5g tube
micronized silverThermal Thermal Conductivity = >5.15 W/mK
Thickness Viscosity = 74.6 CPS